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2Layer Carb on ink  BoardFinished Board Thickness: 1.6mm Halogen Solder maskFinished Copper thickness: 1/1oz  Immersion Gold+Carb on inkThe smallest line width & track: 0.15/0.15mmThe smallest hole size and Solder bridge : 0.2mm & 0.1mm 

2Layer High Frequency Countersunk hole BoardFinished Board Thickness: 1.6mm Black Solder maskFinished Copper thickness: 1/1oz Immersion GoldThe smallest line width & track: 0.075/0.075mm     The smallest hole size and Solder bridge : 0.2mm & 0.1mm

Number of layers：2Layer Thickness：0.3mm Copper thickness：60u” Surface process：Immersion Au Features: high frequency mixed pressure, Rt5880 plate: +fr4