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Manufacturability

Items		2024	2025
layers		(MP):16層，(Sampling)：32層	(MP)：20層
Max. Board THK		Sampling 4.0mm / MP ：3.2mm	Sampling 5.0mm / MP：3.2mm
Min. Board THK		Sampling :0.4mm /MP :0.5mm	Sampling: 0.3mm / MP:0.4mm
Base copper	Inner layer	1/3 ～ 6OZ	1/3～8 OZ
Base copper	Outer layer	1/3 ～ 6 OZ	1/3 ～ 8 OZ
Borehole diameter	Min.PTH	0.2mm	0.15mm
Max. aspect ratio		10:01	12:01
HDI aspect ratio		0.8:1	1:01
Tol	PTH	±0.076mm	±0.05mm
Tol	NPTH	±0.05mm	±0.03mm
solder mask opening		0.05mm	0.03mm
solder dam		(Green) 0.076mm ,	(Green) 0.076mm ,
solder dam		(other color) 0.1mm	(other color) 0.08mm
Min. core THK.		0.1mm	0.08mm
Bow&twist		≤0.5%	≤0.5%
Routing Tol.		Sampling :±0.075mm /MP：±0.1mm	Sampling:±0.075mm /MP：±0.075mm
Impedance Tol.		±10%	±8%
Min. w/s (Inner layer)		0.075 / 0.075mm	0.075 / 0.075mm
Min. w/s (Outer layer)		0.075 / 0.075mm	0.075 / 0.075mm
(Min. BGA size)		0.2mm	0.15mm
（pitch）(Min. BGA Pitch)		0.65mm	0.5mm
(Working panel size)		600mm*700mm	600mm*700mm
Spec. Tech.		Split gold fingers, Counter-bore , Counter-sink, Back-Drill, POFV , Mech. Drilling Blind hole.